StacksVerified U.S. regulatory reference

40 CFR Part 98, Table I-4

Verified against eCFR.gov as of June 20, 2026View official text on eCFR.gov
Process type/sub-typeProcess gas i
CF4C2 F6 | CHF3 | CH2 F2 | CH3 F | C3 F8 | C4 F8 | NF3 | SF6 | C4 F6 | C5 F8 | C4 F8 O

Etching/Wafer Cleaning

1-Ui0.650.80.370.20.30.30.180.160.30.150.1NA
BCF4NA0.210.0760.060.02910.210.0450.0440.0330.0590.11NA
BC2 F60.058NA0.0580.0430.0090.0180.0270.0450.0410.0620.083NA
BC4 F80.0046NA0.00270.0540.007NANANANA0.0051NANA
BC3 F8NANANANANANANANANANA0.00012NA
BCHF30.012NANA0.0570.0160.0120.0280.0230.00390.0170.0069NA
BCH2 F20.005NA0.0024NA0.0033NA0.00210.000740.000020.00003NANA
BCH3 F0.0061NA0.0270.0036NA0.000730.00630.0080.00820.00065NANA

Chamber Cleaning

In situ plasma cleaning

1-UiNANANANANANANA0.2NANANANA
BCF4NANANANANANANA0.037NANANANA
BC2 F6NANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANA

Remote plasma cleaning

1-UiNANANANANA0.063NA0.018NANANANA
BCF4NANANANANANANA0.037NANANANA
BC2 F6NANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANA
BCHF3NANANANANANANA0.000059NANANANA
BCH2 F2NANANANANANANA0.00088NANANANA
BCH3 FNANANANANANANA0.0028NANANANA
BF2NANANANANANANA0.5NANANANA

In situ thermal cleaning

1-UiNANANANANANANA0.28NANANANA
BCF4NANANANANANANA0.01NANANANA
BC2 F6NANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANA

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

[89 FR 31921, Apr. 25, 2024]